Paper number 1206
|ANALYSIS OF THE ENDOTHERMIC BEHAVIOR IN THE CURING PROCESS OF RESOLE|
Jiao Bin1 and Cai Qing2
1FRP Research & Design Institute, P.O. Box 261, Beijing, 102101,China
2Institute of Chemistry, Academia Sinica, Beijing, 100080, China
|Summary||This paper analyzes the behavior of resole by DTA and TG, especially the endothermic behavior in the curing process. Between 130? and 160?, there are one or several endothermic peaks when resole is curing. They are the characteristic peaks of curing behavior, which can be used to identify the curing reaction and describe the flowing feature of resole. In this temperature range, the weight loss of the resole sample is high. Oxides or hydroxides of Ca and Mg can accelerate the curing process and decrease the temperature of exothermic and endothermic peaks in the curing process of resole. The amount is 10% to 15%. The endothermic peaks can be used to determine the process parameters of phenolic resole composites. In the process of phenolic SMC (P-SMC), the molding temperature shall be 20~30? above the endothermic peak's temperature of resole on the DTA and TG thermographs.
||Keywords|| resole, curing endothermic peak, differential thermal analysis (DTA), thermalgravimetric analysis (TG).
Theme : Processing, Integrated Design and Manufacturing
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