Paper number 489

TRANSIENT HEAT CONDUCTION AND THERMAL STRESSES IN FUNCTIONALLY GRADED MATERIALS

Seiichi Nomura

Department of Mechanical and Aerospace Engineering, The University of Texas at Arlington, Arlington, TX 76019{0023, USA

Summary

A semi-analytical method is introduced to derive the transient thermal stress field in functionally graded materials (FGMs) where the physical properties vary continuously from one end of the material to the other end. The transient heat conduction problem in an FGM is solved first and the resulting temperature field is used to compute the thermal stresses in the FGM. The transient temperature field in the FGM is expressed by a series of eigenfunctions for the corresponding eigenvalue problem and the coefficients of each eigenfunction are determined by the Galerkin method with the extensive use of a computer algebra system. The physical fields in FGMs can be expressed semi-analytically while retaining all the relevant parameters. In addition, any change in boundary conditions such as temperature can be readily re ected without incurring the entire recalculation.

Keywords

functionally graded materials, micromechanics, Green's function, transient heat transfer, design.