Paper number 629
|CURE KINETIC MODEL OF EPOXY RESINS FOR LIQUID MOLDING PROCESSES|
Renata S. Engel1, and Jared S. Strait2
1Department of Engineering Science & Mechanics, 227 Hammond Bldg.,
The Pennsylvania State University, University Park, PA 16802, USA
2Land Systems Division, General Dynamics, PO Box 2072, Warren, MI 48090, USA
|Summary||Thermoset resins are used as constituents in fiber reinforced polymeric composites and as such the ability to characterize and describe their cure behavior is vital to numerical simulations of composite manufacturing. This study uses differential scanning calorimetry (DSC) to investigate two different diglycidyl ether of bisphenol A epoxy systems each cured with two different polyoxypropyleneamines--a diamine and triamine. The objective is to report the cure kinetic model parameters and discuss the implications of variations in cure system specification to the results. The autocatalytic cure model employed shows excellent agreement with the experimental results at the low and middle ranges of degree of conversion.
||Keywords|| cure kinetics, process modeling, epoxy resin, DSC.
Theme : Processing, Integrated Design and Manufacturing
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