Paper number 726
|ELEVATED TEMPERATURE TREATMENT OF ARAMID FIBERS TO IMPROVE ADHESION|
Shigeru Ishihara1 and Lawrence T. Drzal2
1Teijin Limited, Fibers Technology Department, Minami-Yoshida-cho
Matsuyama, EHIME 791 -8042 Japan
2Composite Materials and Structures Center, Depts of Chemical Engineering and Materials Science, Michigan State University, East Lansing, Michigan 48824-1226
517-353-5466; Email: firstname.lastname@example.org
|Summary||The objective of this research is to develop a fundamental understanding of adhesion of aramid fibers to an epoxy matrix. In general, aramid fibers are para phenylene terephthalamide, rod-like polymers having a high degree of orientation and high crystallinity. Although these para type aramid fibers have high strength and high modulus, their surface is relatively inert. For composite applications it is necessary to improve the adhesion between fibers and matrices to improve the composite properties. For aramid fibers in tire rubber applications, an epoxy containing coating is placed on the aramid fiber bundle and given a high temperature treatment prior to incorporation into tire rubber. Investigation of this high temperature treatment has led to the conclusion that a minimum temperature of 240oC produces a significant number of chemical bonds between the matrix epoxy groups and the amide groups on the aramid fiber surface which produces a substantial increase in fiber-matrix adhesion. This elevated temperature treatment does not reduce the tensile properties of the aramid fiber.
||Keywords|| fiber-matrix adhesion, aramid, epoxy, surface treatment, Technora.
Theme : Interface and Interphase
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