Paper number 905
|NON ISOTHERMAL SIMULATION OF THE RESIN TRANSFER MOLDING PROCESS|
V. Antonucci, S. Sarlo, M. Giordano, G. Di Vita and L. Nicolais
Department of Materials and Production Engineering, University of Naples "Federico II",
P. le Tecchio 80 - 80125 Naples, Italy
Institute of Composite Materials Technology, National Research Council,
P.le Tecchio 80 - 80125 Naples, Italy
C.I. R.A. SpA - Italian Center for Aerospace Research,
Via Maiorise - 81043 Capua, Italy
|Summary||In this paper the non-isothermal nature of the Resin Transfer Molding process was analyzed, together with the influence of the curing reaction on the temperature profiles. The thermal energy balance was considered for the resin-fibers system, the dry fibers and the mold, in order to evaluate for the whole system the temperature field. The numerical simulations were performed assuming tb use an epoxy resin and a fiber glass preform. The calculated temperature and degree of cure fields are presented in the paper and compared with the literature data.
||Keywords|| resin transfer molding, non-isothermal filling, process simulation.
Theme : Processing, Integrated Design and Manufacturing
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