Paper number 906
|CURE DEPENDENT CREEP COMPLIANCE OF AN EPOXY RESIN|
Daniel J. O'Brien1 and Scott R. White2
1Department of Mechanical and Industrial Engineering, University of Illinois at Urbana-Champaign
1206 West Green, Urbana, IL 61801
2Department of Aeronautical and Astronautcal Engineering, University of Illinois at Urbana-Champaign
104 S. Wright Street, Urbana, IL 61801
|Summary||The cure dependent creep compliance of a difunctional epoxide/tetrafunctional amine epoxy is investigated. Creep data at several cure states is taken over a range of temperatures and shifted according to time-temperature superposition to obtain master curves. The dependence of creep behavior on cure state is shown to be quite dramatic. Fully cured non-stoichiometric specimens are used to determine the equilibrium compliance of the partially cured material. The creep behavior of the partially cured material is shown to be significantly different from the non-stoichiometric material. This difference is attributed to free uncured amines that act as a diluent phase in the partially cured specimens.
||Keywords|| curing, process modeling, creep, epoxy, viscoelasticity.
Theme : Mechanical and Physical Properties ; Creep and Viscoelastic Behaviour
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