ID 1113

 

Thermal Analysis of Solidification Behavior of

SiC(P)/Al-Si Composites

 

 

Shusen Wu*, Ping An*, Guangzhong Wu* and Hideo Nakae**

*College of Materials Science and Engineering,

Huazhong University of Science and Technology (Wuhan 430074, P. R. China)

**Department of Materials Science and Engineering,

Waseda University (Tokyo 169, Japan)

 

Keywords: metal-matrix composites, solidification, thermal analysis, aluminum alloy