ID 1163

 

Cure Monitoring of Thermosetting Composites by

Lacomtech Dielectrometry

 

 

Jae Wook Kwon and Dai Gil Lee

Department of Mechanical Engineering,

Korea Advanced Institute of Science and Technology, ME3221,

Gusong-dong, Yusong-gu, Taejon-shi, Korea 305-701

 

Keywords: dielectrometry, cure monitoring, dissipation factor