Effect of Thermal History on the Thermal
Expansion
Behavior of SiC Whisker Reinforced Aluminum
Composite
M. Hu, W. D. Fei
and C. K. Yao
School of
Materials Science and Engineering, P. O. Box 433,
Harbin Institute
of Technology, Harbin 150001, P. R. China
Keywords: thermal expansion, SiC
whisker, aluminum composite, residual stress