ID 1173


Effect of Thermal History on the Thermal Expansion

Behavior of SiC Whisker Reinforced Aluminum Composite



M. Hu, W. D. Fei and C. K. Yao

School of Materials Science and Engineering, P. O. Box 433,

Harbin Institute of Technology, Harbin 150001, P. R. China


Keywords: thermal expansion, SiC whisker, aluminum composite, residual stress