ID 1206
Residual Stress and Bonding Strength
of 3Y-TZP/Ti Zygote
Dong-Ying Ju*, T.Horii* and
Takashi Mitamura**
*
Department of Mechanical Engineering, Saitama Institute of
Technology,
Fusaiji 1690, Okabe 369-0293,
Japan. ju@sit.ac.jp
** Advanced Science Research Laboratory , Saitama
Institute of Technology,
Fusaiji 1690, Okabe 369-0293, Japan
Keywords:
diffusion bonding method,
heat treatment, residual stress