Seung Jo Kim*, Chang Sung Lee*,
Hun Shin* and Wi Dae Kim**
* Department
Aerospace Engineering, Seoul National University
Kwanak-gu, Seoul 151-742, Republic of
Korea
** Department
Aerospace Engineering, Pusan National University
Keumjeong-ku, Pusan 609-735,
Republic of Korea
Keywords: adhesive
bonding, single-lap joint, wavy-lap joint, interfacial peel stress,
refined 3-D stress
analysis, adherend lay-up, unbalance of adherend material properties