ID 1511


Refined 3-D Stress Analysis and Design of

Composite Wavy-lap Joint



Seung Jo Kim*, Chang Sung Lee*, Hun Shin* and Wi Dae Kim**

* Department Aerospace Engineering, Seoul National University

Kwanak-gu, Seoul 151-742, Republic of Korea

** Department Aerospace Engineering, Pusan National University

Keumjeong-ku, Pusan 609-735, Republic of Korea


Keywords: adhesive bonding, single-lap joint, wavy-lap joint, interfacial peel stress,

refined 3-D stress analysis, adherend lay-up, unbalance of adherend material properties