ID 1597
A Thermal Conductivity
Analysis Affecting Thermoelastic
Stress Measurement of
Laminate Composites
Sunao
Sugimoto*, Robert E. Rowlands# and Takashi Ishikawa*
*:
Structures Division, National Aerospace
Laboratory, Tokyo, Japan
#: Department
of Mechanical Engineering, University of Wisconsin, Madison, Wisconsin, USA
Keywords: thermoelastic stress measurement, thermal
conduction, FEA